Author: Mr. N. Raghuveer Y. Raja, C.H. Tarun, S.V. Kalyan Kumar, M. Abdul Wahid
Doi: https://jmeb.2026.v11.i01.pp96-103
Abstract:
Printed Circuit Boards (PCBs) in modern electronic systems contain multiple heat-generating components operating under both continuous and intermittent conditions. Accurate prediction of temperature distribution is critical for ensuring reliability and preventing thermal failure. In this study, a PCB assembly containing three heat-producing chips is analyzed using the Finite Element Method (FEM) under steady-state and transient conditions. One chip operates continuously, while two additional chips operate intermittently with specified activation intervals.
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